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AURUM JCL3030 PI Mitsui Chemicals 三井化學(xué)
- 品牌：Mitsui Chemicals 三井化學(xué)
- 價(jià)格： ￥13.7/千克
- 發(fā)布日期： 2024-08-09
- 更新日期： 2024-11-22
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| 品牌 | Mitsui Chemicals 三井化學(xué) |
| 貨號(hào) | |
| 用途 | 對(duì)鋼材:高彈性、高PV(無(wú)潤(rùn)滑/油潤(rùn)滑);汽車(chē)ATF部件(止推墊圈墊圈、襯套等)、CTV部件、渦輪增壓器部件、辦公自動(dòng)化設(shè)備部件(隔熱套管、聯(lián)軸器等)、工業(yè)設(shè)備部件 |
| 牌號(hào) | AURUM JCL3030 |
| 型號(hào) | AURUM JCL3030 |
| 品名 | 聚酰亞胺類(lèi) |
| 包裝規(guī)格 | 板、棒、管、方塊、長(zhǎng)條、圓盤(pán)、環(huán)、圓球和定制機(jī)加工制件 |
| 外形尺寸 | 板、棒、管、方塊、長(zhǎng)條、圓盤(pán)、環(huán)、圓球和定制機(jī)加工制件 |
| 生產(chǎn)企業(yè) | Mitsui Chemicals 三井化學(xué) |
| 是否進(jìn)口 |
Vespel 是杜邦公司生產(chǎn)的一系列耐用高性能聚酰亞胺基塑料的商標(biāo)。
特點(diǎn)和應(yīng)用
Vespel 主要用于航空航天、半導(dǎo)體和運(yùn)輸技術(shù)。它結(jié)合了耐熱性、潤(rùn)滑性、尺寸穩(wěn)定性、耐化學(xué)性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會(huì)產(chǎn)生明顯的釋氣,這使得它可用于輕質(zhì)隔熱罩和坩堝支撐。它在真空應(yīng)用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會(huì)吸收少量的水,從而導(dǎo)致放置在真空中的泵時(shí)間更長(zhǎng)。
盡管在這些特性中,有些聚合物都超過(guò)了聚酰亞胺,但它們的結(jié)合是 Vespel 的主要優(yōu)勢(shì)。
熱物理性質(zhì)
Vespel 通常用作測(cè)試熱絕緣體的導(dǎo)熱性參考材料,因?yàn)樗哂懈咴佻F(xiàn)性和熱物理性能的一致性。例如,它可以承受高達(dá) 300 °C 的反復(fù)加熱,而不會(huì)改變其熱性能和機(jī)械性能。已經(jīng)發(fā)布了大量測(cè)量的熱擴(kuò)散率、比熱容和推導(dǎo)密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因?yàn)樗捏w積磁化率(Vespel SP-1 在 21.8 °C 時(shí)為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時(shí)為 -9.03×10?6 [6]) 負(fù)值表示兩種物質(zhì)都是抗磁性的.將NMR樣品周?chē)牧系捏w積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應(yīng)用加工
Vespel 可以通過(guò)直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進(jìn)行加工。對(duì)于原型數(shù)量,通常使用基本形狀以提高成本效益,因?yàn)?DF 零件的工具成本相當(dāng)高。對(duì)于大規(guī)模的CNC生產(chǎn),DF零件通常用于降低每個(gè)零件的成本,而犧牲的材料性能不如等靜壓生產(chǎn)的基本形狀。
類(lèi)型
對(duì)于不同的應(yīng)用,特殊配方被混合/復(fù)合。形狀由三個(gè)標(biāo)準(zhǔn)過(guò)程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產(chǎn)的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質(zhì),而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質(zhì)。
標(biāo)準(zhǔn)聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級(jí),可實(shí)現(xiàn)最小的導(dǎo)電性和導(dǎo)熱性。這是未填充的基質(zhì)聚酰亞胺樹(shù)脂。它還提供高物理強(qiáng)度和 伸長(zhǎng)率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計(jì)),SP-21添加到基礎(chǔ)樹(shù)脂中,可提高耐磨性并減少摩擦,適用于滑動(dòng)軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應(yīng)用。這種化合物具有石墨填充等級(jí)中 的機(jī)械性能,但低于原始等級(jí)。示例:Vespel SP-21。40%石墨(按重量計(jì)),SP-22增強(qiáng)耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計(jì)),SP-211添加到基礎(chǔ)樹(shù)脂中,可在各種操作條件下實(shí)現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達(dá) 149 °C (300 °F)。典型應(yīng)用包括滑動(dòng)軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤(rùn)滑劑),SP-3在真空和其他無(wú)濕環(huán)境中,石墨實(shí)際上會(huì)變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應(yīng)用包括密封件、滑動(dòng)軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應(yīng)用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過(guò)等靜壓成型和機(jī)械加工生產(chǎn))
財(cái)產(chǎn) 單位 測(cè)試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無(wú)量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導(dǎo)熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無(wú)量 綱 在 100 Hz 時(shí) 3.62 13.53
在 10 kHz 時(shí) 3.64 13.28
在 1 MHz 時(shí) 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.128
性能優(yōu)勢(shì)
飛機(jī)發(fā)動(dòng)機(jī)外件
杜邦™ Vespel® 可以幫助解決飛機(jī)發(fā)動(dòng)機(jī)外部部件的嚴(yán)苛密封、磨損、摩擦、振動(dòng)和耐熱性挑戰(zhàn)。
Vespel® 飛機(jī)發(fā)動(dòng)機(jī)風(fēng)扇葉片材料
杜邦™ Vespel® 為飛機(jī)風(fēng)扇葉片耐磨條和葉片墊片提供經(jīng)過(guò)驗(yàn)證的強(qiáng)度、耐磨性和低摩擦。
發(fā)動(dòng)機(jī)部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時(shí)具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
半導(dǎo)體制造后端
尺寸穩(wěn)定的杜邦™ Vespel® 部件是晶圓處理和芯片測(cè)試的理想選擇 - 它們磨損低,不會(huì)損壞金屬或陶瓷等晶圓。
特點(diǎn)和應(yīng)用
Vespel 主要用于航空航天、半導(dǎo)體和運(yùn)輸技術(shù)。它結(jié)合了耐熱性、潤(rùn)滑性、尺寸穩(wěn)定性、耐化學(xué)性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會(huì)產(chǎn)生明顯的釋氣,這使得它可用于輕質(zhì)隔熱罩和坩堝支撐。它在真空應(yīng)用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會(huì)吸收少量的水,從而導(dǎo)致放置在真空中的泵時(shí)間更長(zhǎng)。
盡管在這些特性中,有些聚合物都超過(guò)了聚酰亞胺,但它們的結(jié)合是 Vespel 的主要優(yōu)勢(shì)。
熱物理性質(zhì)
Vespel 通常用作測(cè)試熱絕緣體的導(dǎo)熱性參考材料,因?yàn)樗哂懈咴佻F(xiàn)性和熱物理性能的一致性。例如,它可以承受高達(dá) 300 °C 的反復(fù)加熱,而不會(huì)改變其熱性能和機(jī)械性能。已經(jīng)發(fā)布了大量測(cè)量的熱擴(kuò)散率、比熱容和推導(dǎo)密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因?yàn)樗捏w積磁化率(Vespel SP-1 在 21.8 °C 時(shí)為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時(shí)為 -9.03×10?6 [6]) 負(fù)值表示兩種物質(zhì)都是抗磁性的.將NMR樣品周?chē)牧系捏w積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應(yīng)用加工
Vespel 可以通過(guò)直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進(jìn)行加工。對(duì)于原型數(shù)量,通常使用基本形狀以提高成本效益,因?yàn)?DF 零件的工具成本相當(dāng)高。對(duì)于大規(guī)模的CNC生產(chǎn),DF零件通常用于降低每個(gè)零件的成本,而犧牲的材料性能不如等靜壓生產(chǎn)的基本形狀。
類(lèi)型
對(duì)于不同的應(yīng)用,特殊配方被混合/復(fù)合。形狀由三個(gè)標(biāo)準(zhǔn)過(guò)程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產(chǎn)的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質(zhì),而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質(zhì)。
標(biāo)準(zhǔn)聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級(jí),可實(shí)現(xiàn)最小的導(dǎo)電性和導(dǎo)熱性。這是未填充的基質(zhì)聚酰亞胺樹(shù)脂。它還提供高物理強(qiáng)度和 伸長(zhǎng)率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計(jì)),SP-21添加到基礎(chǔ)樹(shù)脂中,可提高耐磨性并減少摩擦,適用于滑動(dòng)軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應(yīng)用。這種化合物具有石墨填充等級(jí)中 的機(jī)械性能,但低于原始等級(jí)。示例:Vespel SP-21。40%石墨(按重量計(jì)),SP-22增強(qiáng)耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計(jì)),SP-211添加到基礎(chǔ)樹(shù)脂中,可在各種操作條件下實(shí)現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達(dá) 149 °C (300 °F)。典型應(yīng)用包括滑動(dòng)軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤(rùn)滑劑),SP-3在真空和其他無(wú)濕環(huán)境中,石墨實(shí)際上會(huì)變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應(yīng)用包括密封件、滑動(dòng)軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應(yīng)用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過(guò)等靜壓成型和機(jī)械加工生產(chǎn))
財(cái)產(chǎn) 單位 測(cè)試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無(wú)量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導(dǎo)熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無(wú)量 綱 在 100 Hz 時(shí) 3.62 13.53
在 10 kHz 時(shí) 3.64 13.28
在 1 MHz 時(shí) 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
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Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
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Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
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Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
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For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
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Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.128
性能優(yōu)勢(shì)
飛機(jī)發(fā)動(dòng)機(jī)外件
杜邦™ Vespel® 可以幫助解決飛機(jī)發(fā)動(dòng)機(jī)外部部件的嚴(yán)苛密封、磨損、摩擦、振動(dòng)和耐熱性挑戰(zhàn)。
Vespel® 飛機(jī)發(fā)動(dòng)機(jī)風(fēng)扇葉片材料
杜邦™ Vespel® 為飛機(jī)風(fēng)扇葉片耐磨條和葉片墊片提供經(jīng)過(guò)驗(yàn)證的強(qiáng)度、耐磨性和低摩擦。
發(fā)動(dòng)機(jī)部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時(shí)具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
半導(dǎo)體制造后端
尺寸穩(wěn)定的杜邦™ Vespel® 部件是晶圓處理和芯片測(cè)試的理想選擇 - 它們磨損低,不會(huì)損壞金屬或陶瓷等晶圓。
Vespel® ASB 通道幫助飛機(jī)反推器運(yùn)行更長(zhǎng)時(shí)間、更安全
常規(guī)
應(yīng)用
推力反轉(zhuǎn)是發(fā)動(dòng)機(jī)排氣的臨時(shí)分流，使其向前而不是向后。它有助于在飛機(jī)著陸后減慢速度，減少制動(dòng)器的磨損并縮短著陸距離。平移整流罩門(mén)通過(guò)插入機(jī)艙橫梁的 Vespel® ASB-0664 通道內(nèi)的移動(dòng)滑塊打開(kāi)和關(guān)閉。需要平穩(wěn)的平移和低摩擦系數(shù)，以及在發(fā)動(dòng)機(jī)使用壽命期間通道的低磨損。
挑戰(zhàn)
低于 0.20 的低摩擦力可降低驅(qū)動(dòng)力。
能夠在 -70°C 至 130°C（-22°F 至 265°F）之間工作。
40,000 至 80,000 個(gè)操作周期，具體取決于飛機(jī)/發(fā)動(dòng)機(jī)類(lèi)型。
高負(fù)載，3 至 30 MPa（430 至 4300 psi），特別是如果需要用于拒絕起飛 （RTO）。
耐腐蝕、飛機(jī)液體（油、煤油、清潔劑）、真菌、冰。
重量輕。
溶液
Vespel® ASB-0664 是樹(shù)脂浸漬織物與鋁基材粘合的組件。零件可以承受高達(dá) 232°C （450°F） 的溫度。
織物為鋁槽提供低摩擦和耐用的涂層，同時(shí)形成腐蝕屏障。
特點(diǎn)和優(yōu)勢(shì)
耐磨性
Vespel® ASB-0664 在機(jī)艙中具有廣泛的用途，并已在多年的服務(wù)中證明了自己。在各種測(cè)試條件下進(jìn)行的磨損測(cè)試表明，根據(jù)特定的應(yīng)用要求，零件壽命為 80,000+ 次循環(huán)。
低摩擦
PTFE纖維增強(qiáng)了摩擦性能，使動(dòng)態(tài)摩擦系數(shù)降至0.20以下。較高的負(fù)載只會(huì)改善摩擦行為。
高強(qiáng)度
零件可以承受著陸時(shí)典型的高負(fù)載條件以及潛在的拒收 （RTO） 的惡劣條件。
耐腐蝕性和耐化學(xué)性
鋁經(jīng)過(guò)熱處理以提供必要的硬度和剛度。陽(yáng)極氧化可保護(hù)履帶襯板免受腐蝕，而織物則在配合的金屬表面之間形成絕緣屏障。PTFE 纖維的使用可提供對(duì)飛機(jī)操作和維護(hù)中使用的大多數(shù)流體具有抵抗力的部件。
重量 輕
鋁制軌道襯板，如鋁制橫梁中的滑塊，可以減輕機(jī)艙的重量。
組裝和維護(hù)
通道可以很容易地組裝到鋁梁中。可以通過(guò)額外加工或合并附件特征來(lái)添加定制的附件功能。如果需要，可以輕松拆卸和更換通道。
