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AURUM PL500M PI Mitsui Chemicals 三井化學
- 品牌：Mitsui Chemicals 三井化學
- 價格： ￥13.7/千克
- 發(fā)布日期： 2024-08-09
- 更新日期： 2024-11-22
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| 品牌 | Mitsui Chemicals 三井化學 |
| 貨號 | |
| 用途 | AURUM? PL500M 樹脂適用于要求高純度、低脫氣性和耐等離子體的高溫應用。PL500M 樹脂由無定形未填充熱塑性聚酰亞胺 (TPI) 合成物制成。 |
| 牌號 | AURUM PL500M |
| 型號 | AURUM PL500M |
| 品名 | 聚酰亞胺類 |
| 包裝規(guī)格 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 外形尺寸 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 生產企業(yè) | Mitsui Chemicals 三井化學 |
| 是否進口 |
Vespel 是杜邦公司生產的一系列耐用高性能聚酰亞胺基塑料的商標。
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術。它結合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產生明顯的釋氣,這使得它可用于輕質隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結合是 Vespel 的主要優(yōu)勢。
熱物理性質
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經(jīng)發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產,DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質,而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質。
標準聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級,可實現(xiàn)最小的導電性和導熱性。這是未填充的基質聚酰亞胺樹脂。它還提供高物理強度和 伸長率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計),SP-21添加到基礎樹脂中,可提高耐磨性并減少摩擦,適用于滑動軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應用。這種化合物具有石墨填充等級中 的機械性能,但低于原始等級。示例:Vespel SP-21。40%石墨(按重量計),SP-22增強耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計),SP-211添加到基礎樹脂中,可在各種操作條件下實現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達 149 °C (300 °F)。典型應用包括滑動軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤滑劑),SP-3在真空和其他無濕環(huán)境中,石墨實際上會變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應用包括密封件、滑動軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過等靜壓成型和機械加工生產)
財產 單位 測試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無量 綱 在 100 Hz 時 3.62 13.53
在 10 kHz 時 3.64 13.28
在 1 MHz 時 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.135
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經(jīng)過驗證的強度、耐磨性和低摩擦。
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術。它結合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產生明顯的釋氣,這使得它可用于輕質隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結合是 Vespel 的主要優(yōu)勢。
熱物理性質
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經(jīng)發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產,DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質,而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質。
標準聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級,可實現(xiàn)最小的導電性和導熱性。這是未填充的基質聚酰亞胺樹脂。它還提供高物理強度和 伸長率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計),SP-21添加到基礎樹脂中,可提高耐磨性并減少摩擦,適用于滑動軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應用。這種化合物具有石墨填充等級中 的機械性能,但低于原始等級。示例:Vespel SP-21。40%石墨(按重量計),SP-22增強耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計),SP-211添加到基礎樹脂中,可在各種操作條件下實現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達 149 °C (300 °F)。典型應用包括滑動軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤滑劑),SP-3在真空和其他無濕環(huán)境中,石墨實際上會變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應用包括密封件、滑動軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過等靜壓成型和機械加工生產)
財產 單位 測試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無量 綱 在 100 Hz 時 3.62 13.53
在 10 kHz 時 3.64 13.28
在 1 MHz 時 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.135
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經(jīng)過驗證的強度、耐磨性和低摩擦。
高性能 Vespel® 傳動系統(tǒng)組件有助于控制摩擦、限制磨損并降低卡死風險
杜邦™ Vespel® 零件有助于減少摩擦造成的能量損失，使傳動系統(tǒng)更高效、更耐用、更輕便、更堅固。Vespel® 在苛刻的負載和不良的潤滑條件下都是可靠的。此外，它使工程師即使在低潤滑條件下也能突破光伏極限。
與同類材料相比，Vespel® 組件具有更高的耐用性和更好的可靠性。汽車制造商之所以選擇 Vespel® 傳動系統(tǒng)組件，是因為它們：
降低癲癇發(fā)作的風險
不熔化
即使在苛刻的 PV 限制
下也表現(xiàn)出低磨損 在高溫
下保持出色的尺寸穩(wěn)定性 允許小型化和輕
量化 耐受典型的變速箱潤滑劑和潤滑脂
使用超低粘度潤滑劑
由于出色的摩擦性能，可減少扭矩損失
在傳動系統(tǒng)應用中，Vespel® 零件（如密封環(huán)、止推墊圈、襯套和叉墊）在以下方面表現(xiàn)出色：
自動變速器、CVT（無級變速器）和雙離合變速器
分動箱
液力變矩器
其他傳動系統(tǒng)部件
使用壽命長，解決方案經(jīng)濟高效
在重型非公路變速器和液壓馬達中，Vespel® 密封環(huán)和止推墊圈提供長壽命和具有成本效益的解決方案，以滿足較短的交貨時間要求和生產量要求。
