產(chǎn)品展廳
Vespel ASB-0126 PI DuPont 杜邦
- 品牌:DuPont 杜邦
- 型號(hào):板、棒、管、方塊、長(zhǎng)條、圓盤、環(huán)、圓球和定制機(jī)加工制件
- 價(jià)格: ¥13.7/千克
- 發(fā)布日期: 2024-08-09
- 更新日期: 2024-11-23
產(chǎn)品詳請(qǐng)
品牌 | DuPont 杜邦 |
貨號(hào) | |
用途 | Vespel? ASB 組件包括將復(fù)合材料或碳石墨緊固/粘合到支撐金屬結(jié)構(gòu)上,或?qū)⒁环N材料與另一種材料(如熱塑性塑料)包覆成型/嵌件成型。 這種集成能力為幫助解決挑戰(zhàn)提供了更多的可能性。 |
牌號(hào) | Vespel ASB-0126 |
型號(hào) | Vespel ASB-0126 |
品名 | 聚酰亞胺類 |
包裝規(guī)格 | 板、棒、管、方塊、長(zhǎng)條、圓盤、環(huán)、圓球和定制機(jī)加工制件 |
外形尺寸 | 板、棒、管、方塊、長(zhǎng)條、圓盤、環(huán)、圓球和定制機(jī)加工制件 |
生產(chǎn)企業(yè) | DuPont 杜邦 |
是否進(jìn)口 |
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.47
溫度、高摩擦和重負(fù)荷?自 1965 年以來,在惡劣的條件下,Vespel® 的性能表現(xiàn)優(yōu)于其他工程材料。
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.47
在 條件下值得信賴
Vespel® 部件和型材適用于惡劣的工業(yè)操作環(huán)境
溫度、高摩擦和重負(fù)荷?自 1965 年以來,在惡劣的條件下,Vespel® 的性能表現(xiàn)優(yōu)于其他工程材料。
諸如航空航天部件,半導(dǎo)體加工,汽車制造和能源生產(chǎn)等要求苛刻的應(yīng)用依靠 Vespel® 零件來保證其設(shè)備運(yùn)行。
Vespel®聚酰亞胺材料可在低溫至高溫下連續(xù)運(yùn)行; 在潤(rùn)滑或未潤(rùn)滑的環(huán)境中,在高 PV 下的低磨損和低摩擦; 優(yōu)異的抗蠕變,高強(qiáng)度和抗沖擊性; 出色的尺寸穩(wěn)定性; 低熱膨脹系數(shù); 以及易加工性。
Vespel® 使零件重量更輕不僅切實(shí)可行,而且在許多情況下優(yōu)于通用金屬,陶瓷和其他工程聚合物,例如 PEEK(聚醚醚酮)和 PAI(聚酰胺-酰亞胺) )。
在亞洲、歐洲和美洲的設(shè)計(jì)中心,杜邦技術(shù)人員與客戶一起合作,將材料科學(xué)與設(shè)計(jì)相結(jié)合,以生產(chǎn)高性能零件并保持生產(chǎn)平穩(wěn)運(yùn)行。
Vespel® 部件與型材(無論定制的還是常規(guī)規(guī)格)都經(jīng)過測(cè)試,已在 苛刻的應(yīng)用中經(jīng)過測(cè)試并證明可靠。它們有板、棒、管、方塊、長(zhǎng)條、圓盤、環(huán)、圓球和定制機(jī)加工制件。[
用途
- 軸承、襯套、絕緣件、密封件、止推墊片和耐磨環(huán)
- 耐磨墊、耐磨條和管夾
- 熱塑性注塑、裝配和復(fù)合部件
- 測(cè)試插座和晶圓導(dǎo)軌
- 玻璃夾持技術(shù)
- 離心泵中的耐磨部件
- 碳?xì)浠衔?、化學(xué)品和給水泵
- 飲用水應(yīng)用
優(yōu)勢(shì)
- 低蠕變和低釋氣
- 輕質(zhì)但能承受高負(fù)荷
- 耐化學(xué)性、耐電氣、耐磨損和耐熱性
- 強(qiáng)度、剛性和尺寸穩(wěn)定性
- 易于機(jī)加工,可加工至非常緊密的公差
- 在極限真空、輻射、氧氣相容性、低溫條件以及暴露于火焰的情況下行之有效
- 制造成本低于陶瓷